Korea Business News Agency - NSP NEWS AGENCY.

(Seoul=NSP NEWS AGENCY) = SK hynix announced that it has decided to build an advanced packaging production base for AI memory in West Lafayette, Indiana, USA, and cooperate in semiconductor research and development with local research institutes such as Purdue University.

The company plans to invest $3.87 billion(about KRW 5.2 trillion) in this business.

The company held an investment agreement ceremony with officials from Indiana State, Purdue University, and the U.S. government at Purdue University in West Lapiet on the 3rd local time and officially announced the plan.

SK hynix said, “The Indiana plant plans to mass produce AI memory products such as next-generation HBM starting in the second half of 2028,” and added, “Through this, we will take the lead in revitalizing the global AI semiconductor supply chain.”

The Governor of Indiana said, “The state of Indiana is a global leader in creating innovative products that will become the driving force of the future economy,” and added, “I am confident that our new partnership with SK hynix will develop the state of Indiana and the local community, including Purdue University, in the long term.”

“We are pleased to build the semiconductor industry’s first advanced packaging production facility for AI in the U.S.” “With this investment, we will continue to provide customised memory products to meet the increasingly sophisticated needs and expectations of our customers,” said the CEO of SK hynix.

By Soon-ki Lee(s8789@nspna.com) and Bok-hyun Lee(bhlee2016@nspna.com)

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