SK Hynix, Started Mass Production of ‘HBM2E’, a High-Speed DRAM.
NSP NEWS, By soon ki Lee Journali
END7, Read 0(Seoul=NSP News Agency) soon ki Lee Journalist = SK Hynix has begun mass production of ‘HBM2E, a high-speed DRAM.
HBM2E is a product capable of processing 3.6 gigabits per second(Gbps) of data, and can process 460 gigabytes (GB) of data per second through 1024 information outlets (I/O).
HBM2E is the fastest existing DRAM solution that can deliver 124 FHD(Full-HD) movies(3.7GB) in one second. Its capacity is also 16GB that is more than doubled from previous generation by connecting eight 16-gigabit(Gb) DRAM chips vertically with TSV(Through Silicon Via) technology.
HBM2E, which has ultra-high-speed, high-capacity, and low-power characteristics, is attracting attention as a memory solution optimized for next-generation AI(artificial intelligence) systems such as Deep Learning Accelerator, which requires high computational power, and high-performance computing.
HBM2E is a product capable of processing 3.6 gigabits per second(Gbps) of data, and can process 460 gigabytes (GB) of data per second through 1024 information outlets (I/O).
HBM2E is the fastest existing DRAM solution that can deliver 124 FHD(Full-HD) movies(3.7GB) in one second. Its capacity is also 16GB that is more than doubled from previous generation by connecting eight 16-gigabit(Gb) DRAM chips vertically with TSV(Through Silicon Via) technology.
HBM2E, which has ultra-high-speed, high-capacity, and low-power characteristics, is attracting attention as a memory solution optimized for next-generation AI(artificial intelligence) systems such as Deep Learning Accelerator, which requires high computational power, and high-performance computing.
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In addition, it is expected to be adopted in the Exascale supercomputer(a high-performance computing system capable of performing ten quadrillion times per second) that will lead the research of next-generation basic and applied science, such as meteorological changes, biomedicine, and space exploration.
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