Intel, Cooperating with Tower… Announcement of New US Foundry Contract
NSP NEWS, By Soon-ki Lee and Bok-hyun Lee
ENX7, Read 0(Seoul=NSP NEWS AGENCY) = Intel Foundry Service(IFS) and Tower Semiconductor(Hereafter referred to as ‘Tower’), semiconductor contract manufacturing company(foundry), announced foundry cooperation.
Through this cooperation, Intel will provide foundry services and 300mm manufacturing capabilities to help Tower support customers around the world.
In addition, Tower will utilize Intel’s production facilities located in New Mexico, USA. Tower plans to invest up to $300 million to acquire and own equipment and other fixed assets to be installed at its New Mexico facility. This will secure over 600,000 monthly photolayer processing capacity for Tower’s future growth, supporting expected customer demand for advanced 300mm advanced analog processing.
Through this cooperation, Intel will provide foundry services and 300mm manufacturing capabilities to help Tower support customers around the world.
In addition, Tower will utilize Intel’s production facilities located in New Mexico, USA. Tower plans to invest up to $300 million to acquire and own equipment and other fixed assets to be installed at its New Mexico facility. This will secure over 600,000 monthly photolayer processing capacity for Tower’s future growth, supporting expected customer demand for advanced 300mm advanced analog processing.
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Through this agreement, both companies will expand their influence in the foundry market based on their best solutions and manufacturing capabilities.
Intel manufactures Tower’s 65 nanometer(nm) power management BCD(bipolar-CMOS-DMOS) flow at Intel’s 11X Fab in Rio Rancho, New Mexico.
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