(Seoul=NSP NEWS) = SK Hynix is ​​establishing its first High Bandwidth Memory(HBM) production base in Indiana, USA.

SK Hynix held a groundbreaking ceremony for an advanced packaging production base for artificial intelligence(AI) memory at Purdue University in West Lafayette, Indiana, on August 27.

The total investment is over $4 billion. The company plans to complete the cleanroom in October 2028 and begin mass production of next-generation HBMs in the second half of 2029.

This method involves transporting semiconductor wafers produced in Korea to the Indiana plant for advanced packaging and performance testing before supplying them to U.S. customers. Once the plant is operational, it will serve as SK Hynix’s first HBM production base in the U.S. and a key facility for supplying U.S.-made HBM.

Along with production facilities, state-of-the-art packaging research and development testing facilities will also be established. Clients, universities, and partners plan to jointly develop next-generation packaging technologies and proceed with prototype production and performance verification.

SK Hynix has signed a research and development agreement with Purdue University to jointly research next-generation system integration and advanced packaging technologies based on HBM.

Currently, over 100 materials, parts, and equipment companies are discussing entering West Lafayette. SK Hynix plans to create approximately 7,000 direct and indirect jobs locally through the construction and operation of its factory.

The company is also participating as an employer in the employment platform for discharged U.S. Forces Korea personnel to expand its recruitment of personnel within the United States.

The CEO of SK Hynix stated, “The Indiana plant will become a hub for providing the first U.S.-made HBM,” adding, “We will expand our investment and cooperation in the U.S. to become a trusted partner in the AI ​​industry.”