(Seoul=NSP NEWS) = SK Hynix announced that it has started mass production of 238-layer 4D NAND flash and is in the process of product certification with overseas customers that produce smartphones.
“Based on 238-layer NAND, we developed cSSD(Client SSD) solution products for smartphones and PCs and started mass production in May,” said SK Hynix, “We expect these products to serve as a driving force to improve the company’s management performance in the second half of the year as we have secured world-class competitiveness in terms of cost, performance, and quality in 238-layer as well as the existing 176-layer.”
The 238-layer NAND, implemented with the world’s smallest chip, is 34% more efficient than the previous generation’s 176-layer, significantly improving cost competitiveness. The data transmission speed is 2.4Gb(gigabit) per second, which is 50% faster than the previous generation. Reading and writing performance is also improved by about 20%, and the company is confident that it will be able to provide improved performance to smartphone and PC customers using this product.
SK Hynix will supply 238-layer NAND starting with mobile products after completing certification of smartphone customers. Afterwards, it plans to expand the scope of application of 238-layer NAND to include SSDs for PCs that support PCIe 5.0 and high-capacity SSDs for data centers.
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