(Seoul=NSP NEWS AGENCY) = SK hynix succeeded in developing ‘HBM3E,’ a new ultra-high-performance DRAM for AI, and started supplying samples to customers for performance verification procedures.
HBM(High Bandwidth Memory) is a high-value, high-performance product that innovatively increases data processing speed compared to existing DRAM by connecting multiple DRAMs vertically.
SK Hynix said, “Based on our experience in mass production of HBM3 exclusively, we have succeeded in developing HBM3E, an extended version with the world’s best performance. We will mass-produce HBM3E from the first half of next year and solidify our unrivaled position in the AI memory market.”
According to the company, this HBM3E met the world’s highest standards in all aspects, including speed, which is an essential specification for memory for AI, heat control, and customer convenience.
In terms of speed, the HBM3E can process up to 1.15TB(terabytes) of data per second. This is the level of processing the data of more than 230FHD(Full-HD) movies(5GB = 5GB) in one second.
In addition, SK hynix engineers applied the latest advanced MR-MUF technology to this product to improve the product’s heat dissipation performance by 10% compared to the previous product. HBM3E also has backward compatibility, so customers can apply new products without any design or structural changes even to systems configured with HBM3 in mind.
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